IEEE-EPS-IESA  Semiconductor Packaging Event Wraps Up with Resounding Success in Bengaluru

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IEEE-EPS-IESA  Semiconductor Packaging Event Wraps Up with Resounding Success in Bengaluru
IEEE-EPS-IESA  Semiconductor Packaging Event Wraps Up with Resounding Success in Bengaluru

 

Bengaluru, December 4th, 2023: The India Electronics and Semiconductor Association (IESA) and IEEE Electronics Packaging Society (EPS) proudly announce the successful conclusion of the 2023 IEEE-EPS-IESA Semiconductor packaging event. The two-day event, held on 30th November and 1st December at The Lalit Ashok, Bengaluru, served as a pivotal platform for industry leaders, innovators, and experts to engage in transformative discussions on the future of Semiconductor packaging in India from design and manufacturing perspectives.

The summit focused on critical aspects of the Semiconductor Packaging Industry including : Technologies, Heterogeneous Integration, OSAT/ATMP, Design and Simulation tools, Emerging technologies and materials, Optical technologies, R&D, and skilling. The extensive range of topics covered reflected the rapidly evolving landscape of Semiconductor packaging , offering insights into the latest advancements and challenges faced by the industry.

One of the highlights of the summit was the 2023 IEEE EPS IESA Workshop on Semiconductor Packaging, which saw the participation of numerous dignitaries and technical experts. The workshop provided a unique opportunity for stakeholders to collaborate, share knowledge, learn new insights and explore innovative solutions in the field of semiconductor packaging.

With more than 25 distinguished speakers, the summit featured engaging sessions on a variety of subjects, such as ‘The Reincarnation of Interconnects in the Chiplet Era’, ‘Building an Open Ecosystem of Chiplets for On-package Innovations’, ‘Advanced Integration of Optical Interconnects’, ‘Photonic Integration on 3D System-in-package: Architecture and Development’, ‘Chiplet Integration Challenges and Considerations’, ‘The New Semiconductor and Packaging Destination’, ‘Packaging by the Numbers’, and more.

Mr. Sanjay Gupta, Chairman, IESA, commented, “As we conclude the IEEE EPS IESA event, I am thrilled by the collective energy and expertise showcased by the industry leaders, innovators, and experts who gathered to shape the future of electronics. This summit exemplifies the spirit of collaboration, driving advancements in semiconductor technology and packaging that propels India’s position in the global electronics landscape.

Mr. Ashok Chandak, President, IESA, resonated a similar sentiment by saying, “This event has been a testament to the dynamism of the evolving electronics industry and IESA’s initiative in steering our industry forward to the new era. IESA is proud to contribute to driving the growth and innovation of semiconductors packaging design and manufacturing.”

The summit served as a hub for networking, fostering collaboration among professionals, researchers, and industry stakeholders. Attendees had the opportunity to explore the latest trends, learn from experts, share insights, and establish valuable connections that will contribute to the continued growth and innovation in the electronics and semiconductor sector.

IESA and IEEE-EPS remain committed to advancing the electronics industry through collaboration, innovation, and knowledge-sharing. The success of the 2023 IEEE-EPS-IESA semiconductor packaging event marks a significant milestone in this journey.